As described in our client alert earlier this month, the National Institute of Standards and Technology’s CHIPS Program Office published a Funding Opportunity Announcement (FOA) directed towards funding the construction, expansion, or modernization of commercial facilities for the front- and back-end fabrication of leading-edge, current-generation, and mature-node semiconductors. During this last week of March, the CHIPS Program Office made available a series of resources to help applicants prepare their pre-application and application materials for the FOA. A summary of and links to those resources are set forth below:
The CHIPS Program Office also announced that it will host a series of public webinars that will provide interested parties the opportunity to ask questions and to learn more about these materials. You can register for these webinars at chips.gov.
As a reminder, the applications timelines under the FOA are:
- For Leading Edge semiconductor manufacturing
- March 31, 2023: Pre-applications and applications accepted
- NOTE: A Statement of Interest must be submitted at least 21 days before submitting a pre-application or full application
- For current-generation, mature-node, and back-end manufacturing facilities
- May 1, 2023: Pre-applications accepted
- June 26, 2023: Applications accepted
- NOTE: A Statement of Interest must be submitted at least 21 days before submitting a pre-application or full application
