On November 28, 2024, the Hong Kong Monetary Authority (HKMA) published the guideline on Digital Bond Grant Scheme (DBGS). As acknowledged in the 2024 Policy address, the DBGS is part of the Hong Kong Government and HKMA’s efforts to promote the development of the digital securities market in Hong Kong, as well as supporting Hong Kong’s position as a leading international financial center.
Effective on October 16, 20241, the DBGS, will provide subsidies of up to HKD1.25 million (for half grant) and up to HKD2.5m (for full grant) to eligible applicants to cover costs of issuing digital bonds in Hong Kong, subject to certain criteria and conditions, for an initial period of three years.
Please see full publication below for more information.
